Thermal Management Materials for Electronic Devices and Their Applications in Power Electronics

Abstract

This paper systematically investigates the thermal management material system of electronic devices and its applications in power electronics. First, the heat generation mechanisms of typical devices such as vacuum tubes, transistors, and power amplifiers are analyzed. Based on Fourier’s law of heat conduction, the heat transfer governing equations and thermal resistance network models are established. Subsequently, the thermal properties and application mechanisms of high-thermal-conductivity metals, ceramics, carbon-based materials, and thermal interface materials are studied in detail. Finite element simulation methods are then employed to analyze the temperature distribution in electronic devices. Finally, typical heat dissipation structures and thermal failure mechanisms are discussed, and future development trends of advanced thermal management materials and multiphysics coupled design are presented.The results indicate that the core of thermal management in electronic devices lies in reducing interface thermal resistance, optimizing heat conduction paths, and constructing multiscale synergistic thermal dissipation systems. This work provides theoretical guidance and engineering references for thermal design and material optimization of high-power electronic devices.